Surface texturing is an important toll to improve the conversion efficiency of silicon solar cell.
Wafers are placed in a phosphorous-rich environment to form "the transition layer" of the semiconductor device
(solar cell). This process effectively makes the cells suitable for making p-n diode.
Anti-reflection coating is one of the most important processes to enhance efficiency by reducing the reflection at
the surface of solar cell. To form an anti-reflection coating, a layer of transparent material is deposited on the
surface with precisely controlled thickness.
Formation of metal contact. The metal contact includes front silver, rear silver and rear aluminum for BSF(back-surface field).
The wafers are fired in a high-temperature furnace. The silver and aluminum paste previously deposited on the
surface, fuse and bond into the surface of the silicon.
Removal of the short circuit path between the front and rear surface of the wafers is carried out by isolating the transition layer at the edges of the wafer.